JCET''s certificated Quality Test Center provides reliability tests, including environmental reliability tests, life reliability tests, and board level reliability tests; and a full range of failure analysis services.
JCET provides a full range of advanced packaging and testing solutions, including 2.5D/3D packaging, wafer-level packaging, system-in-package (SiP), etc., and one-stop solutions, including collaborative
JCET delivers world-class services to its customers. The greatest value from doing business with JCET is realized when engaging JCET as a full turnkey solutions provider – including IC design and
Enhancing this foundation, the RFFE module utilizes fully integrated designs, advanced materials, and system-level packaging innovations to meet the demands of the smart era and deliver
The company offers packaging and test services, including wafer bumping, probing, grinding, and various IC packaging solutions, as well as RF, analog, digital, and mixed signal testing.
JCET offers the broadest portfolios of comprehensive packaging and test services in the semiconductor industry and can leverage its strong packaging and test capabilities to provide a full turnkey solution
For high-performance computing and storage scenarios such as HPC data centers, JCET has developed a systematic portfolio of packaging and testing solutions covering computing, storage,
According to a report from UDN, China''s largest semiconductor packaging and testing company, JCET, has completed the planning and
Shanghai, China, January 21 — JCET Group today announced a key milestone in co-packaged optics (CPO). The company has delivered customer samples of its silicon photonics engine developed on
JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and
Company profile JCET Group is the world''s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey
The greatest value from doing business with JCET is realized when engaging JCET as a full turnkey solutions provider–from IC design through test program development, wafer bump, wafer probe, multi
In power and analog device manufacturing, JCET leverages extensive expertise in wafer processing, advanced architectures, and high-temperature/thermal-diffusion materials.
JCET Group is the largest Outsourced Semiconductor Assembly and Test (OSAT) company in mainland China and the third-largest globally. JCET also provides semiconductor manufacturing, product
JCET offers a full spectrum of semiconductor packaging services to meet diverse customer needs, spanning lead-frame packaging, substrate-based packaging, flip-chip interconnects, and advanced
By integrating optical engines with ASICs in a single package, we achieve shorter optical paths, optimized thermal management, and reliable system-level performance.
JCET delivers world-class services to its customers. The greatest value from doing business with JCET is realized when engaging JCET as a full turnkey solutions provider–from IC design through test
Yaojian Lin, VP of Engineering and General Manager of R&D Center, JCET Group Speech Title: Packaging Fundamentals of High-Performance Applications • Si node technology in IC scaling is becoming
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level
JCET is also actively promoting the mass production applications of core materials such as ceramic substrates for new energy power module packaging (DBC/DBA/AMB), aluminum wire, aluminum
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