As pluggable modules scale to 400G and beyond, thermal management becomes a primary reliability constraint. Explore the latest strategies in air and liquid cooling, and discover the future of optical module cooling. Read Time: 6 Min Bandwidth for chip-to-chip and chip-to-memory. Laird's OptiTIMTM product is designed to overcome the challenges of cooling optical transceiver modules in Telecom, Data Centers and Enterprise Systems markets. OptiTIM is a durable thermal interface material that can withstand the insertion and removal requirements of the pluggable module while. For manufacturers and network equipment providers, choosing the right high-speed PCB solution is no longer optional—it directly impacts signal integrity, insertion loss, EMI control, and long-term reliability.